Thinning of silicon wafers and GaAs wafers, substrates and dice
Ultra-Thin Silicon Wafers and Gallium Arsenide Wafers
Valley Design Corporation has developed a process and is supplying on a regular basis, ultra-thin Silicon and GaAs (with circuitry) precision lapped or (CMP), chemically-mechanically polished.
Substrates as thin as 10 microns thick with circuitry were completed. A recent order called for 5" diameter wafers of 3 mil thickness (polished on both sides). Valley Design offers a complete line of lapped, polished and diced substrates, Sapphire, Glass, flat optical pieces and other electro-optical materials.
Scratch/Dig | Angstroms Ra | Microinches Ra |
---|---|---|
10/5 | 10A | .040u" |
20/10 | 20A | .080u" |
40/20 | 30A | .12u" |
60/40 | 40A | .16u" |
80/50 | 50A | .2u" |
Note: Approximate optical scratch/dig and Ra relationship for surface finishes.
Wafer, chip, dice, die thinning related Web sites:
- www.valleydesign.com/ultra-thin-ceramics.htm Thin Ceramics and thin Ceramic substrates and wafers
- www.valleydesign.com/ultra-thin.htm Silicon wafer and die thinning, backlapping and polishing
- www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing
- www.ultra-thin.com/sitemap.htm Ultra-thin glass, wafer and chip site map