www.siliconwafers.net
Polished Silicon Wafers
Valley Design specializes in providing customized polished silicon wafers and related materials with precise specifications, offering a range of sizes, thicknesses, and surface finishes suitable for semiconductor, MEMS, optoelectronic, and sensor applications, supported by over 50 years of experience and advanced polishing and dicing services.

Polished silicon wafers are thin, round pieces of single-crystal silicon that have been processed to produce a smooth, mirror-like surface. Polishing removes irregularities and imperfections that the wafer slicing and grinding processes may have introduced. Polishing eliminates microscopic pits, scratches, and other surface defects that could interfere with subsequent fabrication processes. Additionally, it removes any contaminants that may have stuck to the wafer during earlier stages, ensuring a clean surface for future manufacturing steps. The flawless, smooth, defect-free surface of the polished silicon wafers is vital for manufacturing high-performance semiconductor devices with consistent properties and tight tolerances.
Typical applications for polished silicon wafers include:
- MEMS Devices
- Microprocessors, Memory Chips, Integrated Circuits
- Optical Components
- Renewable Energy
- Sensors
- Thin-Film Applications
- Transistors and Circuit Boards
Valley Design provides premium Silicon wafer polishing services customized to meet clients’ specific needs, delivering excellent optical surface finishes of less than 10 Å Ra. With over 50 years of experience in polishing Silicon wafers, we also provide Silicon dicing services. We can supply silicon wafers in custom sizes, ranging from as large as 450mm to as small as 0.127 mm square. SEMI-standard silicon wafers are available in diameters of 2”, 3”, 100mm, 125mm, 150mm, 200mm, 300mm, and 450mm. Standard Silicon wafers can be thinned and polished to any custom thickness, as thin as 10 microns, with standard tolerances or as tight as +/- 1 micron.
Valley Design has extensive experience providing silicon polishing and dicing services to clients across various industries, including research, optoelectronic applications, and product development in sensor and laser fields. We also offer edge-angle polishing for optoelectronic applications and bonded wafer thinning. Additionally, we can thin and polish individual silicon dies and SOI (Silicon Oxide) layers.
Customized Silicon Wafers
Valley Design can customize a silicon wafer to any size or thickness you need for your project. We offer optical grade silicon CZ (Czochralski) in as-cut wafers, lapped or polished, as well as single and double-sided polished options. Various orientations, resistivities, and dopings are available. Valley Design can supply silicon wafers that meet your specific requirements. Our silicon polishing and dicing services are renowned for their precision in meeting stringent specifications. We understand that delivering high-quality products and services is essential to our customers’ technology, which is why we always take the time to understand your exact specifications before beginning work.
Whether you’re in need of custom or semi-standard silicon wafers or other materials such as optical glass, fused silica, fused quartz, ceramics like aluminum nitride, 96% Alumina, 99.6% Alumina, sapphire, and more, Valley Design can help.
Valley Design can supply:
- 99.6% Alumina
- a complete line of polished Fused Silica
- Aluminum Nitride
- CZ Silicon wafers
- Sapphire wafers and substrates
- Thin Silicon wafers – as thin as 0.001″ (25 microns)
- Ultra-pure to 10,000 ohm-cm
- Ultra-thick Silicon wafers
For solutions to your complex technological needs, partner with the company that has consistently led in innovation, developing the processes and techniques now standard in manufacturing substrates and components for MEMS and many other applications. Contact us online or call 978-425-3030. Together, let’s create something exceptional!
Informative related Web sites:
www.customdicing.com Dicing Silicon and all other semiconductor material wafers
www.semi.org Semiconductor Equipment and Materials International (SEMI)
valleydesign.com Polishing all semiconductor materials and thinning wafers, substrates and dice
https://valleydesign.com/ultra-thin/ Ultra-thin Sapphire, Ceramics, Glass, Fused Silica and Semiconductor wafers and substrates
https://valleydesign.com/laser-slag/ Chamfering, blending, shaping and rounding wafers and substrates
www.avs.org AVS – The Science and Technology Society
https://valleydesign.com/germanium-crystals/ Germanium wafers and substrates