CMP Wafer Polishing of Silicon, Germanium, GaAs, GaP
CMP Semiconductor Material Polishing
CMP semiconductor polishing from Valley Design Corp. with large enough equipment to handle 300 mm wafers.
These machines utilize the most advanced hydroplane polishing techniques and are ideal for Silicon (Si), Germanium (Ge), Gallium Phosphide (GaP), and other semiconductor and optical materials.
Custom single and double side wafer polishing of all semiconductor and optoelectronic materials for:
- MEMS
- Ultra-thin wafers
- Anodic bonding
- SOI
Other CMP Wafer polishing related Websites:
Contact Valley Design for all your polishing needs!