Precision Dicing, Singulating and Cutting of All Materials

In addition to Sapphire, Silicon, Ceramics, Glass, and Quartz, we have the ability to dice Silicon Carbide, Iridium, Copper, Tungsten Carbide, Brass, Hafnium, Stainless Steel and many other materials. Characteristics such as rounded or chamfered corners and edges, along with good perpendicularly can be specified on any order.

Other Web sites with dicing information:

• valleydesign.com/dice Disco wafer and substrate chucks reconditioned
• valleydesign.com/substrate-dicing Dicing wafers, substrates, circuits and optical windows
• valleydesign.com/semi-wafers Polished glass wafers and substrates to SEMI standards