Silicon Lapping Service
Valley Design Corp. now offers precision lapping and backlapping of silicon and other semiconductor materials in prototype and production quantities.
Customer supplied wafers in sizes up to 12″ diameter, can be lapped on one or both sides. During backlapping, the circuit side of the wafer can be protected by various compatible processes. The finished wafers can be returned in wafer boats or even mounted on individual carriers for further processing by the customer.
Thickness tolerances as close as ±0.0001 in. are possible, and parts can be lapped to as thin as 0.001 inches.
This service is an extension of Valley Design’s custom ceramic, quartz, glass and metal polishing business.