Polished polyimide wafers and substrates
Pure Unfilled Polyimide Polished Wafers and Substrates
The low dielectric constant, excellent processing characteristics, chemical resistance, flexibility, high temperature stability and smooth polished surface finish make pure, unfilled thermoset polyimide a desirable material for numerous critical applications.
Polished Polyimide Wafers Currently In Stock:
All items listed below are polished on one side to 5nm Ra surface roughness.
| PART # |
THICKNESS |
DIAMETER |
| PI – P1 – Ø2X020 |
0.020″ |
2″ |
| PI – P1 – Ø3X020 |
0.020″ |
3″ |
| PI – P1 – Ø100XØ500 |
500 µm |
100 mm |
| PI – P1 – Ø150XØ500 |
500 µm |
150 mm |
Thinner and thicker wafers are available on special order. Please call or
email for details.
Polyimide wafer high performance applications include:
- Thin film substrates
- Packaging applications
- Silicon and metal foil strain gauges
Solar cell substrates- MEMS microstructures
Valley Design Corp. manufactures polished polyimide
wafers under license from Opticomp Networks US Patents No. 6, 563, 998 and 6, 807, 328.