Silicon Wafers and Silicon Ingots
In 1975, Valley Design began polishing 2” diameter Silicon wafers, then continually expanded our polishing capabilities in keeping with the Semiconductor Industry to 3” diameter, then 100mm, 125mm, 150mm, 200mm eventually landing at 300mm diameter. Looking forward, the Semiconductor industry contemplated transitioning lithography fabs to 450mm, but it was not generally accepted by the equipment manufacturers. Valley Design has performed back grinding and lapping of 450mm diameter Silicon wafers, and also routinely laps, polishes, dices and CNC machines Silicon in all sizes. Ultra-thin is also available as thin as 20um thick.
Other Services:
- Ingot orientation
- Ingot grinding to diameter
- Orientation – flat grinding
- Ingot etching
- Crystal wafering – slicing into thin wafers
- Edge rounding
- Wafer lapping
- Wafer etching – acid or base
- Polishing
- Cleaning
- Packaging – clean room