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CMP Semiconductor Wafer Polishing
Custom wafer polishing has been the company's specialty for over 25 years. From 3 mm optical windows to 300 mm Silicon wafers double side polished are all part of past experience.
- Double side polished wafers to TTV < 1 micro-meter
- Flatness (bow and warp) of less than 5 micro-meters
- Surface finish as low as 2-3 Angstroms Ra is possible
- 100 mm diameter only 50 micro-meters thick – no problem
- Cut, lap, etch, and polish
- Class 10 cleanroom inspection and packaging
- Wafer dicing up to 150 mm
- Edge rounding
- SOI wafer thinning and polishing
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