Precision Silicon Wafer Dicing

State-of-art dicing saws are fully programmable and equipped with microscope and video for precision alignment. We offer accurate dicing for silicon wafers up to 6″ in diameter ESD protected when required.

Depending upon the material, the dicing kerf may be as small as 1 mil and die size as small as 5 mils square. Partial cut and break services or 100% saw through on tape or other carrier are available.

Services include slotting, cutting through layered assemblies like Silicon-on-Glass, machining grooves, Sapphire and Glass.

For damaged damaged Disco and K & S wafer chuck repair service, click here.

For Precision Dicing, Do You Need a Quick Quotation?

Whether you require dicing or cutting of standard materials like Silicon and Quartz, or you need to develop dicing and cutting procedures for untried materials, Customer Service will work with you to achieve your quality and product goals.

• Material type? Yours or ours?
• Is a print available?
• Are dimensions in mm or inches?
• Starting length and width or diameter?
• Starting quantity?
• Finished piece, chip or die size and expected yield?
• Tolerances and maximum allowable edge chip size?
• Is there a pattern or metalization? Is it a step and repeat?
• Allowed blade thickness, kerf or street width?
• Is there a preferred mounting technique?
• Are the surfaces protected? Do the surfaces need a protective coating?
• Can the pieces be left mounted?
• If it is left mounted and cleaned, what special instructions?
• Delivery requirements?
• Is there a budget?

Silicon wafer dicing related Web sites:


www.semi.org SEMI Semiconductor Equipment and Materials International

https://valleydesign.com/sitemap/ Wafer custom dicing

https://valleydesign.com/sitemap/ Edge and angle polishing

https://valleydesign.com/sitemap/ Substrate chamfering


Return to Home Page: Polished silicon wafers and polishing services