Fused Silica Wafers and Substrates

Corning 7980 is a type of fused silica, a high-purity, non-crystalline, colorless glass. It is known for its excellent optical properties, high ultraviolet transmission, and low thermal expansion. Its uses include photomask substrates, furnace linings, components for etching and deposition processes, and applications involving UV light.

Corning has discontinued the Fused Silica Corning 7940 wafer material and replaced it with HPFS (High Purity Fused Silica) 7980, which is an excellent choice for UV-grade Fused Silica wafers. Both fused silica wafer materials are nearly identical in composition, properties, and transmission, enabling them to be used interchangeably. The material is a high-purity synthetic amorphous silicon dioxide produced through flame hydrolysis. It offers several advantageous features, including an extremely low coefficient of thermal expansion, excellent homogeneity with superior optical qualities, and outstanding UV transmittance.

Principal uses for UV Fused Silica:

• Graded seals
• Heater tubing
• High-quality coating substrates and wafers
• Laser optics
• Lightpipes
• Mirror blanks and substrates
• Optical beamsplitters and filters
• Optical grade UV Fused Silica windows and lenses
• Prisms
• Solar cells
• Space and aircraft windows
• Wedges

Applications for Fused Silica Wafers:

• Sstronomical
• Common UV
• Excimer and Nd: YAG laser applications
• High temperature
• Low CTE
• Measurement and sensor technology
• MEMS
• Microlithography
• Optoelectronic
• Thermal imaging
• …and where superior grade fused silica wafers are required.

Thermal/Mechanical properties of Corning UV Grade Fused Silica:

• Annealing Point: 1042°C/1907.6°F
• Bulk Modulus: 37.4 GPa
• Coefficient of Thermal Expansion (CTE):
  • 0.52 ppm/K @ 5-35°C
  • 0.57 ppm/K @ 0-200°C
  • 0.48 ppm/K @ -100 – 200°C
• Compressive Strength: 1.14 GPa
• Density (at 25°C / 77°F): 2.201 g/cm3
• Knoop Hardness (100g load): 522 kg/mm2
• Modulus of Rupture, abraded: 52.4 MPa
• Poisson’s Ratio: .179
• Shear Modulus: 30.6 GPa
• Softening Point: 1585°C/2885°F
• Specific Heat: .770 J/g K
• Strain Point: 893°C/1639.4°F
• Tensile Strength: 54 MPa
• Thermal Conductivity: 1.38 W/mK
• Thermal Diffusivity: .0075 cm2/s
• Young’s Modulus: 72.1 GPa
• Dialectric Constant: E=3.8
• Refractive Index: nD = 1,45840 (589nm)

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Many Fused Silica wafer sizes are available from stock.

Other fused silica wafer related web pages:

Fused silica and fused quartz flat optics and windows
Fused silica and fused quartz wafers and substrates
Optically polished fused silica, fused quartz and single crystal quartz
Fused silica wafers and fused quartz substrates, windows and plates