All Materials Lapped, Polished and Diced
Valley Design laps, polishes, dices and machines a wide variety of materials for semiconductors and electro optics
As a leader in precision materials processing for nearly 50 years, Valley has extensive experience with a wide variety of materials. We process various semiconductor materials, optical materials and materials used in electro optics. Valley provides precision lapping, polishing, optical polishing, dicing services and CNC micro machining services for various industries and applications which has enabled us to gain expertise with many types of hard and soft materials including:
- Aluminum Nitride (AlN)
- Fused Silica (Si02)
- Borosilicate Glass
- Optical Glass (B270, D263, Eagle XG, Gorilla Glass, Supremax Glass, Xensation Glass)
- Ceramics
- 96% Alumina and 99.6% Alumina
- Silicon Carbide
- Ferrites
- Germanium
- Macor
- InP
- LiF
- Metals (Stainless Steel, Aluminum, Copper, Titanium)
- Molybdenum
- Polarcor
- Pyrex 7740 and Borofloat
- Polyimide and PEEK
- Fused Quartz and Single Crystal Quartz
- Sapphire (R-plane, C-plane, A-plane)
- Silicon
- Soda Lime Glass
- Steatite
- ZnS, ZnSe
Valley also stocks many of these materials. Semiconductor materials and optical materials may be provided in any form from SEMI standard wafers ranging in size from 2″ diameter up to 450mm diameter, or custom parts of almost any size. Special capabilities include ultra-thin (as thin as 10um on some materials), ultra-flat 1/10 wave, super polishing to < 10/5 scratch/dig, tight tolerances +/- .5um, TTV .5um. We can process sizes from as small as 0.127mm square, to lapping and polishing of parts as large as 64″. For a complete summary of Valley Design’s capabilities, please visit valleydesign.com.