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Direct Bond Copper on Aluminum Nitride Substrates
DBC is a process where solid Copper foil is bonded to AlN substrate at a high temperature in an inert atmosphere. These DBCu substrates can have Copper thickness from 0.001" (25 microns) to 0.012" (300 microns) and can be nickel or gold plated if required.
Why Aluminum Nitride substrates with DBC?
- Electrical conductivity 95% of pure Copper
- High metal to substrate thermal conductivity
- Substrate with high thermal conductivity and high electrical conductance
- Can be nickel and gold plated for wire bonding and die attachment
- Solderable and can also be brazed
- Large size up to 5 x 7 inches
- Compatible with thick film Copper technology
- Wide range of Copper thickness 25 to 300 microns
- Can be patterned by etching
- Holes can be laser drilled, or ultrasonically drilled
Typical sizes of Aluminum Nitride DBC Substrates:
- AlN 5.4″ x 7.5″ x .015″ thick, with DBCu on both sides .005″ thick
- AlN 5.4″ x 7.5″ x .025″ thick, with DBCu on both sides .005″ thick
- AlN 5.4″ x 7.5″ x .025″ thick, with DBCu on both sides .008″ thick
- AlN 5.4″ x 7.5″ x .025″ thick, with DBCu on both sides .012″ thick
- AlN 5.4″ x 7.5″ x .040″ thick, with DBCu on both sides .008″ thick
These DBC AlN substrates can then be diced, thinned, lapped or polished further by Valley Design.
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