CMP Wafer Polishing of Silicon, Germanium, GaAs, GaP

These machines utilize the most advanced hydroplane polishing techniques and are ideal for Silicon (Si), Germanium (Ge), Gallium Arsenide (GaAs), Gallium Phosphide (GaP), and other semiconductor and optical materials.

Custom single and double side wafer polishing of all semiconductor and optoelectronic materials for:

• MEMS
• Ultra-thin wafers
• Anodic bonding
• SOI

Other CMP Wafer polishing related Websites:

• valleydesign.com/optical-grade-silicon
  Optical Grade Silicon
• 
  valleydesign.com/shaping
  Semiconductor Material shaping
• 
  valleydesign.com/pr5.htm
  Electro-optical materials
• 
  valleydesign.com/ultra-thin-polishing/
  Silicon wafer and die thinning, backlapping and polishing
• 
  valleydesign.com/silicon-polishing
  Polished Silicon wafers, substrates, windows and plates

Contact Valley Design for all your polishing needs!