Substrate and Microchip Edge Rounding

A unique edging process could solve your microchip, window, and substrate corner rounding problems.

• Edge rounding and chamfering
• Edge shaping and beveling
• Edge lapping and polishing
• Edge deburring and blending
• Laser slag removal
• Sharp corner rounding and deburring
• Prepare edges for circuit wraparound applications
• Enhanced – via edge rounding and contouring

The degree of rounding is controllable to a few microns. This process is adaptable to most materials including Ceramics, Fused quartz-Silica, Glass, Silicon, Aluminum Nitride, hard metals, and various other hard and semi-hard materials.

For more information, go to:

• Laser hole and edge chamfering and blending
• Substrate edge rounding and blending
• External: SEMI Semiconductor wafer edge rounding specifications
• Wafer dicing, sawing, singulating and backgrinding