Disco wafer and substrate dicing chucks reconditioned
Dicing Chucks Reconditioned
For precision semiconductor wafer dicing and hybrid circuit substrate sawing, vacuum/wafer chucks in perfect condition are a necessity. Valley Design repairs damaged chucks on East and West coasts.
Wafer chucks, also referred to as vacuum chucks, can be reconditioned when worn or do not meet user's needs for flatness, parallelism or level of surface defects.
In dicing operations chucks are easily damaged. Harsh environment, continuous use and accidents all contribute to dicing chuck damage. Most chucks can be restored to the original or tighter tolerance condition. Turnaround time of one to several days (depending on size and complexity of the part) will keep your machine downtime to a minimum.
Wafer and vacuum chuck related Web sites: