Laser Slag Removal

By various masking techniques, more material can be removed from one side than from the other, and on substrate edges, it is possible to round one or more edges and leave other edges sharp. The degree of rounding is controllable as well. This process can be used to clean slag from one or both sides and to chamfer rectangular or round holes or any shapes.

Each of these benefits is available without the usual risks associated with high velocity blasting techniques. This process is adaptable to most materials including:

• Aluminum NitrideAlN
• Fused Silica
• Quartz
• Glass
• 99.6% Alumina substrates
• 96% Alumina substrates
• Silicon Carbide SiC