Laser slag, substrate and wafer chamfering
Substrate Slag Removal and Chamfering
Valley Design Corp. has developed a proprietary process utilizing precisely graded pure Aluminum Oxide micro-abrasive powder as the vehicle for laser slag removal and edge rounding on substrates and laser holes.
By various masking techniques, more material can be removed from one side than from the other, and on substrate edges, it is possible to round one or more edges and leave other edges sharp. The degree of rounding is controllable as well. This process can be used to clean slag from one or both sides and to chamfer rectangular or round holes or any shapes.
Each of these benefits is available without the usual risks associated with high velocity blasting techniques. This process is adaptable to most materials including:
- Aluminum NitrideAlN
- Fused Silica
- 99.6% Alumina substrates
- 96% Alumina substrates
- Silicon Carbide SiC