Wafering, Sawing and Cutting of Crystals and Glass by Valley

Valley Design Corp. has recently expanded their wafering capabilities to include Crystals and glasses such as Quartz, Fused Silica, Fused Quartz, Silicon, infrared materials like ZnSe, ZnS, and Germanium, along with numerous other materials.

The best yields and tightest tolerances are achieved using I.D. diamond sawing technology. By maintaining kerf loss as low as .011″, more pieces per inch of material are yielded, an important consideration when dealing with expensive materials. Other techniques are used on harder materials where the I.D. technology is not suitable.