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Laser Drilled Holes in Polyimide Wafers
Polyimide can be easily shaped and drilled by laser. Photos show micro-machined holes in 635um (.025") thick polyimide. The holes are 50um (.002") in diameter placed 100um (.004") on center.
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Laser drilled polyimide
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Top view of drilled polyimide wafer
Polyimide wafers are ideal where requirements include the need for interconnecting with low dielectric constant material, high speed, high density substrates for 3-D System-in-Package and Package-on-Package applications.
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