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Laser Drilled Holes in Polyimide Wafers
Polyimide can be easily shaped and drilled by laser. Photos show micro-machined holes in 635um (.025") thick polyimide. The holes are 50um (.002") in diameter placed 100um (.004") on center.
Laser drilled polyimide
Top view of drilled polyimide wafer
Polyimide wafers are ideal where requirements include the need for interconnecting with low dielectric constant material, high speed, high density substrates for 3-D System-in-Package and Package-on-Package applications.
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