Polished silicon wafers, substrates, windows and plates

Strips up to 14″ long can be accommodated, as well as wafers up to 14″ in diameter with a <10 Angstrom or 1 nm surface finish or better. Round 2″ to 6″ Silicon wafers are polished routinely.

This service is the company’s latest addition to their precision lapping, polishing, backlapping and dicing capabilities. Similar processes are available for other semiconductor materials. Valley Design is equipped to meet even the most demanding thickness tolerance and parallelism specifications.