Thinning of silicon wafers and GaAs wafers, substrates and dice

Substrates as thin as 10 microns thick with circuitry were completed. A recent order called for 5″ diameter wafers of 3 mil thickness (polished on both sides). Valley Design offers a complete line of lapped, polished and diced substrates, Sapphire, Glass, flat optical pieces and other electro-optical materials.

Note: Approximate optical scratch/dig and Ra relationship for surface finishes.

Wafer, chip, dice, die thinning related Web sites:

• valleydesign.com/ultra-thin-ceramics
  Thin Ceramics and thin Ceramic substrates and wafers
• valleydesign.com/ultra-thin
  Silicon wafer and die thinning, backlapping and polishing
• valleydesign.com/custom-dicing/thin-dice/
  Thin dice by thinning after dicing
• valleydesign.com/sitemap
  Ultra-thin glass, wafer and chip site map