Thinning of silicon wafers and GaAs wafers, substrates and dice
Ultra-Thin Silicon Wafers and Gallium Arsenide Wafers
Valley Design Corporation has developed a process and is supplying on a regular basis, ultra-thin Silicon and GaAs (with circuitry) precision lapped or (CMP), chemically-mechanically polished.
Substrates as thin as 10 microns thick with circuitry were completed. A recent order called for 5" diameter wafers of 3 mil thickness (polished on both sides). Valley Design offers a complete line of lapped, polished and diced substrates, Sapphire, Glass, flat optical pieces and other electro-optical materials.
|Scratch/Dig||Angstroms Ra||Microinches Ra|
Note: Approximate optical scratch/dig and Ra relationship for surface finishes.
Wafer, chip, dice, die thinning related Web sites:
- www.valleydesign.com/ultra-thin-ceramics.htm Thin Ceramics and thin Ceramic substrates and wafers
- www.valleydesign.com/ultra-thin.htm Silicon wafer and die thinning, backlapping and polishing
- www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing
- www.ultra-thin.com/sitemap.htm Ultra-thin glass, wafer and chip site map