Dicing Sapphire Wafers and Sapphire Substrates

Sapphire wafers and substrates come in many orientations, the most common being A-Plane and C-Plane (very machinable) and R-Plane (difficult to machine). Each offers different optical characteristics unimportant for mechanical applications. This is a difficult material to dice, however Valley’s process produces the least amount of chipping possible. On edges which require an optical quality surface, Valley also offers optical edge and angle polishing of these end faces.

For a complete summary of dicing capabilities click here.

Dicing related Web sites:

• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing
• https://valleydesign.com/custom-dicing/edge-rounding/ Diced chip and substrate edge-rounding
• https://valleydesign.com/custom-dicing/custom-dicing/ Custom wafer dicing, cutting, sawing and singulating
• https://valleydesign.com/custom-dicing/thin-dice Thin dice by thinning after dicing
• https://valleydesign.com/sapphire-wafers Sapphire wafers and substrates