Chip Capacitor and Resistor Dicing

Dicing saws are fully programmable and are equipped with microscope and video for precision alignment. The company’s capabilities extend your fabrication services, and help you to meet production deadlines as your requirements for kerf, chip specifications and delivery are satisfied.

Extensive stock of thin substrates that are ideal for thin and thick film chip capacitor and chip resistor manufacturing. These materials include 96% and 99.6% Alumina Ceramics, Aluminum Nitride, Fused Silica, Glass and many others.

For a complete summary of dicing capabilities click here.

Chip capacitor dicing and material related dicing Web pages:

• https://valleydesign.com/ultra-thin/chip-capacitors Chip capacitors Ceramic substrates
• https://valleydesign.com/custom-dicing/edge-rounding/ Diced chip and lasered substrate edge rounding
• valleydesign.com/substrate Aluminum Nitride and Alumina Ceramic substrates
• www.acers.org American Ceramic Society
• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing, sawing, singulating and wafer backgrinding