Dicing Services
Precision Dicing as small 0.127mm square
Dicing services involve precisely cutting semiconductor wafers and various materials like ceramics, glass, and sapphire into individual dies. Valley Design offers customized, programmable dicing solutions for materials including silicon, alumina, and sensitive semiconductors. They support both prototype and large-scale production using advanced techniques for complex patterns and small die sizes.
Dicing services involve cutting or separating individual electronic chips (dies) from a processed wafer, which is a thin slice of semiconductor material typically made of silicon, on which numerous identical electronic circuits are built. This process is also called die singulation. It is a crucial step in the manufacturing of semiconductors and other electronic components.
Dicing services are also used for various materials, such as ceramics, glass, quartz, and sapphire, for different applications. Dicing requires high precision to ensure each die is accurately separated without damage. Different materials need different dicing techniques and services to accommodate them.
Valley Design offers customized dicing, slicing, and cutting services, from research and development prototypes to large-scale production. Our dicing saws are fully programmable and equipped with a microscope and video system for precise alignment. Over the past fifty years, Valley Design has consistently handled both customer-supplied and Valley Design-sourced materials up to 8 inches in diameter, with options for larger sizes available upon request.
Valley Design specializes in dicing not only conventional materials but also in developing dicing and cutting protocols for new materials. The materials we work with include:
- Alumina
- Aluminum Nitride
- Ceramics
- Crystals
- Ferrites
- Fused Silica
- LiN
- Quartz
- Sensitive Compound Semiconductors Like GaN and InP.
- Silicon
- Various Types of Glass
Depending on the material, the kerf can be as narrow as 20 microns, with dies diced to sizes as small as 0.127 mm square. Valley has extensive experience in dicing patterned wafers, circuit substrates, patterned optics, optically coated wafers, slotted heat sinks, repetitive patterns, as well as slots, steps, and v-grooves.
For solutions to your complex technological needs, partner with the company that has consistently led innovation, developing the processes and techniques now standard in manufacturing substrates and components for MEMS and many other applications. Contact us or call 978-425-3030. Together, let’s create something exceptional!
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