Chip Capacitor and Resistor Dicing

Dicing saws are fully programmable and are equipped with microscope and video for precision alignment. The company’s capabilities extend your fabrication services, and help you to meet production deadlines as your requirements for kerf, chip specifications and delivery are satisfied.

Extensive stock of thin substrates that are ideal for thin and thick film chip capacitor and chip resistor manufacturing. These materials include 96% and 99.6% Alumina Ceramics, Aluminum Nitride, Fused Silica, Glass and many others.

View our complete summary of dicing capabilities.

Chip capacitor dicing and material related dicing Web pages:

• Chip capacitors Ceramic substrates
• Diced chip and lasered substrate edge rounding
• Aluminum Nitride and Alumina Ceramic substrates
• External: American Ceramic Society
• Wafer dicing, sawing, singulating and wafer backgrinding