Dicing Sapphire Wafers and Sapphire Substrates

Sapphire wafers and substrates come in many orientations, the most common being A-Plane and C-Plane (very machinable) and R-Plane (difficult to machine). Each offers different optical characteristics unimportant for mechanical applications. This is a difficult material to dice, however Valley’s process produces the least amount of chipping possible.

Browse Valley Design’s complete summary of dicing capabilities.

Dicing related Web sites:

• Wafer dicing
• Diced chip and substrate edge-rounding
• Custom wafer dicing, cutting, sawing and singulating
• Thin dice capabilities
• Sapphire wafers and substrates