Diamond dicing and cutting

Silicon, Gallium Arsenide, Indium Phosphide, Alumina, Aluminum Nitride, Gallium Nitride, BK7, Pyrex, Ferrites, Quartz, Sapphire, Fused Silica, Glass and Metal Rods, Patterned Optics, Chip Capacitors, Chip Resistors, IC Chips, Laser Diodes, Ceramics, Glass, Silicon Carbide and numerous others.

Valley has been actively engaged in dicing these materials and products for over 25 years. Our recently expanded dicing facilities on both East and West coasts, allow us to handle prototype requirements up to high volume production quantities. We dice on tape or hard carrier, with or without frames.

Equipment: Disco dicing saws and other air bearing spindle dicing machinery can handle disks and squares up to 6″ in diameter or square, and as large as 6″ x 14″ rectangles.

Capabilities: We can handle materials up to 8″x 18″ and any thickness. Chip size as small as .005″ square. Kerf as low as .0008″ Delivery–as fast as 24 hours.

For a complete summary of our dicing capabilities click here.

Custom diamond dicing related Web sites:

• https://valleydesign.com/custom-dicing/sapphire/ Dicing sapphire wafers and substrates
• https://valleydesign.com/request-a-quote/ Precision optical dicing
• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing