We have been polishing Silicon wafers for over 50 years, and also provide Silicon dicing services. We can provide any size Silicon wafer in custom dimensions from as large as 450mm to chips as small as .127mm square. SEMI standard Silicon wafers are also available in diameters 2”, 3”, 100mm, 125mm, 150mm, 200mm, 300mm and 450mm. Standard Silicon wafers can be thinned and polished to any custom thickness as thin as 10 microns thick and are available in standard tolerances, or as tight a thickness tolerance as +/- 1 micron.
We have extensive experience with providing silicon polishing and dicing services to clients in a variety of industries, such as research, optoelectronic applications, and product development in sensor and laser applications. We also provide edge-angle polishing for optoelectronic applications, and bonded wafer thinning. We can also thin and polish individual silicon dies and SOI (Silicon Oxide) layers.
Customize Silicon Wafers
Valley Design can customize a Silicon wafer to any size or thickness that you require for your project. We offer optical grade silicon CZ (Czochralski) in as-cut wafers, lapped or polished, as well as single and double side polished. Various orientations, resistivity and dopings are available. Valley Design can deliver Silicon wafers that meet your needs, no matter how specific your requests. Our Silicon polishing and dicing services are renowned for accuracy in meeting exacting specifications. We understand that providing top quality products and services are critical to our customers’ technology, which is why we always take the time to ensure that we understand the exact specifications of your order before setting to work.
Whether you are in the market for custom or SEMI standard Silicon wafers, or any other material such as optical glass, fused silica, fused quartz, ceramics such as Aluminum Nitride, 96% Alumina and 99.6% Alumina, Sapphire and more, Valley Design can help!
We supply:
- Thin Silicon wafers – as thin as 0.001″ (25 microns)
- Ultra thick Silicon wafers
- Ultra pure to 10,000 ohm-cm
- For CZ Silicon wafers currently available, please click here
We offer a complete line of polished Fused Silica , 99.6% Alumina, Aluminum Nitride , and Sapphire wafers and substrates.
Informative related Web sites:
www.customdicing.com Dicing Silicon and all other semiconductor material wafers
www.semi.org Semiconductor Equipment and Materials International (SEMI)
valleydesign.com Polishing all semiconductor materials and thinning wafers, substrates and dice
https://valleydesign.com/ultra-thin/ Ultra-thin Sapphire, Ceramics, Glass, Fused Silica and Semiconductor wafers and substrates
https://valleydesign.com/laser-slag/ Chamfering, blending, shaping and rounding wafers and substrates
www.avs.org AVS – The Science and Technology Society
https://valleydesign.com/germanium-crystals/ Germanium wafers and substrates