Precision dicing, singulating and cutting of all materials
Precision Dicing, Production Dicing, Contract Dicing
Precision dicing capabilities at Valley Design Corp now include metallic materials. Rods, substrates, wafers, plates and optical components can be diced to custom specifications, with dice as small as .005"x.005" and dicing kerf as small as .001".
In addition to Sapphire, Silicon, Ceramics, Glass, and Quartz, we have the ability to dice Silicon Carbide, Iridium, Copper, Tungsten Carbide, Brass, Hafnium, Stainless Steel and many other materials. Characteristics such as rounded or chamfered corners and edges, along with good perpendicularly can be specified on any order.
Other Web sites with dicing information:
- www.valleydesign.com/dice.htm Disco wafer and substrate chucks reconditioned
- www.valleydesign.com/pr1.htm Dicing wafers, substrates, circuits and optical windows
- www.valleydesign.com/semi-wafers.htm Polished glass wafers and substrates to SEMI standards