For critical applications in:
Unique services provided include edge/angle polishing, precision dicing, fiber array polishing, ultra-thin components, tight tolerances, super finishes (< 10/5 scratch-dig), long rod end polishing, IC die thinning and other hard to find state-of-the-art solutions. Fused quartz wafers are also available in 300mm diameter to SEMI specifications. Many other sizes are available from stock. Please call or e-mail for a quotation to meet your requirements.
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