Fused Quartz and Fused Silica

For critical applications in:

• Fused quartz and fused silica flat optical components
• WDM
• DWDM
• MEMS
• Ultra-thin fused quartz
• Silicon-on-insulator

Unique services provided include edge/angle polishing, precision dicing, fiber array polishing, ultra-thin components, tight tolerances, super finishes (< 10/5 scratch-dig), long rod end polishing, IC die thinning and other hard to find state-of-the-art solutions. Fused quartz wafers are also available in 300mm diameter to SEMI specifications. Many other sizes are available from stock. Please call or e-mail for a quotation to meet your requirements.

Fused quartz, fused silica and MEMS related web sites:

• Fused silica fused quartz substrates and wafers
• MEMS and bonded SOI ultra-thin silicon wafers
• Dicing hybrid semiconductor and MEMS circuits
• Properties of Corning 7980 Fused Silica

Polished silicon wafers and polishing services