Valley stocks precision lapped Ceramic substrates for thin and thick film capacitor manufacturers. Typical sizes are 1″, 2″, 3″, 4″ square x 0.002″ – 0.005″ thick. Surface finish is fine lapped both sides 8-16 u” Ra. Other sizes and thicknesses are available, as thin as 0.002″ (50 microns). These substrates can also be diced into dies as small as .010″ square.
During the chip capacitor fabrication process, cracks can be introduced during any time during steps such as pick and place machining, vacuum pick-up, board depanelization, soldering, test fixturing, connector insulation and final assembly. Valley’s process has been optimized to minimize stresses in Ceramic materials, even at very thin states.
When polished Ceramics are required, Valley stocks 99.6% Alumina which can be polished to 0.5 u” Ra. Stock sizes range from 1″ – 4″ square x 0.002″ – 0.005″ thick.
Other materials are also utilized for dielectric thin substrates including Quartz, Sapphire, steatites and others. These are also stocked and processed by Valley Design.