Thin Sapphire Windows and Substrates

With R-plane sapphire [1102] orientation, a realistic thickness for wafers and substrates is 75 microns (0.0029″). C-plane sapphire may also be thinned to as thin as 75 microns.

Size is not a real limitation for thin wafers and substrates. Parts 12½” x 2½” x 0.0035″ have been produced in polished Sapphire.

Depending on orientation, polished sapphire is available with a surface finish less than 5 Angstroms, and measured on our WYKO non-contact interferometer.

Other sapphire wafer services provided by Valley Design include dicing, sapphire cnc machining, backgrinding, wafer thinning, hole drilling, and edge and angle polishing.

Available from stock are A-plane sapphire wafers to thinness of 0.001″ (25 microns) and R-plane sapphire wafers, starting as thin as .003″ (75 microns). These may be lapped or polished on 1 or 2 sides.

Sapphire wafer and substrate related Web sites:

• https://valleydesign.com/custom-dicing/sapphire/.htm Dicing of Sapphire wafers and substrates
• valleydesign.com/sapp.htm Polished Sapphire wafers, disks and washers