MEMS Bonded Wafer Dicing

Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz , and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.

Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.

For a complete summary of dicing capabilities click here.

Additional information on related Web sites:

• https://valleydesign.com/custom-dicing/custom-dicing/ Dicing, cutting and singulating different materials
• https://valleydesign.com/custom-dicing/edge-rounding/ Diced chip and substrate edge rounding
• https://valleydesign.com/silicon-wafers Polished Silicon wafers
• https://valleydesign.com/silicon-wafers/thinned Silicon wafers thinned to produce thinner dice
• https://valleydesign.com/ultra-thin/silicon-wafers MEMS and Bonded SOI Silicon wafers
• www.memsnet.org MEMS information clearing house
• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing, sawing, singulating and backgrinding