MEMS Bonded Wafer Dicing

Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz, and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.

Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.

View our complete summary of dicing capabilities.

Additional information on related Web sites:

• Dicing, cutting and singulating different materials
• Diced chip and substrate edge rounding
• Polished Silicon wafers
• Silicon wafers thinned to produce thinner dice
• MEMS and Bonded SOI Silicon wafers
• External: MEMS information clearing house
• Wafer dicing, sawing, singulating and backgrinding