Archives: Landing Domains

• Dicing patterned wafers and substrates
• Dicing circuited wafers
• Dicing step and repeat patterns
• AlN hybrids
• V-grooves
• Slots and steps
• Cubes
• Heat sinks
• Pyramids
• Towers
• Hexagons
• Triangles
• Octagons

CRITICAL PARAMETERS such as: cutting speed, spindle speed, surface speed, depth of cut, blade cooling and type of blade are constantly monitored and can vary with PRODUCT AND MATERIAL TYPE. It is important to know if the material is: thin tape cast AlN, thick tape cast AlN, dry pressed AlN or some other type.

Aluminum Nitride varies greatly between manufactures and could require dicing parameter changes.
For a complete summary of dicing capabilities click here

Other links to Aluminum Nitride related sites.

AlN informative Web sites:

• https://valleydesign.com/aluminum-nitride/alnplus Chemical analysis of Aluminum Nitride substrates
• https://valleydesign.com/aluminum-nitride/beo-aln/ Beryllium oxide substrates vs. Aluminum Nitride substrates
• https://valleydesign.com/aluminum-nitride/polished Polished Aluminum Nitride AlN substrates and wafers
• https://valleydesign.com/aluminum-nitride/substrate-mfg Tape cast Aluminum Nitride substrate manufacturing

Aluminum Nitride Related Web Pages:

• Polished Aluminum Nitride substrates and wafers
• Dicing Aluminum Nitride substrates
• Tape Casting Guide for Aluminum Nitride substrates
• Slag Removal Laser hole edge deburring
• Beryllium Oxide and Aluminum Nitride substrates
• Aluminum Nitride chemical Analysis
• Aluminum Nitride physical, mechanical, thermal and electrical properties
• Aluminum Nitride Ceramic substrates

Aluminum Nitride Links:

• www.edgepolishing.com Edge and angle polishing for optoelectronic devices
• https://valleydesign.com/laser-slag/ Laser hole edge deburring, chamfering, and blending
• https://valleydesign.com/ceramic-substrates/ Dicing hybrid and semiconductor circuits, prototype and production
• valleydesign.com Lapping, polishing, and dicing by Valley Design Corp.
• https://valleydesign.com/quartz-silica Fused Silica and Fused Quartz substrates
• https://valleydesign.com/silicon-wafers Polished Silicon wafers
• https://valleydesign.com/ultra-thin Ultra thin wafers, chips, Ceramics, Sapphire and Fused Silica

More Links

With facilities in Santa Cruz, CA and Shirley, MA, Valley is one of the world’s leaders in supplying polished Aluminum Nitride substrates and wafers of all sizes and thicknesses.

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Aluminum Nitride AlN Polished Substrates 175 W/mk

• Delivery from stock
• Minimum order $400.00

For additional information:

• https://valleydesign.com/quartz-silica/aluminum-nitride/ Aluminum Nitride AlN chemical analysis
• www.mrs.org Materials Research Society
• https://valleydesign.com/laser-slag/aln/ Aluminum Nitride AlN laser slag removal
• https://valleydesign.com/custom-dicing/aln-links/ Aluminum Nitride related information Web sites
• www.edgepolishing.com/aluminum-nitride Aluminum Nitride AlN mechanical, physical, chemical and electrical properties
• valleydesign.com/substrate Aluminum Nitride AlN and Alumina Ceramic Substrates

Ultra-thin polished Fused Quartz wafers, discs and substrates are fabricated from raw material including GE124, Momentive i21, Tosoh Quartz and Heraeus. In 10mm square size, Fused Quartz can be polished to as thin as 10-15 microns thick. Valley laps, polishes, dices and CNC machines fused quartz, and can provide any size, standard or custom.

The manufacturing process to create Fused Quartz, is comprised of electrically fusing or gas/oxygen flame fusing natural Quartz powders. Some desirable material characteristics of Fused Quartz include good transmission from the near UV to the near IR spectrum, low coefficient of expansion (CTE), wide operating temperature range, high resistance to shock and corrosion, and excellent electrical insulation properties. Fused Quartz and Fused Silica are many times used interchangeably, however, Fused Quartz has less transmission in the UV spectrum, and a lower OH (water) content which may impact some optical applications. Bubble class or inclusions also need to be considered.

Fused Quartz can be used for many applications such as viewport windows and pressure windows, optical component mirrors, test flats and standard optical components for the semiconductor, telecommunications, medical and photonic industries.

Fused Quartz wafers 3″(75 mm) diameter, 4″(100 mm) diameter, 125mm diameter, 150mm diameter, 200mm diameter and 300mm diameter are readily available in standard thicknesses such as .5mm, 1mm and 1.5mm thick. They can also be thinned and polished to any custom thickness. Typical surface finish is 20/10 scratch/dig, but a finer optical polish as low as 10/5 scratch/dig, < 7 Angstroms is also available.

Valley also stocks a large quantity of Fused Silica wafers, substrates, discs and windows in a wide variety of sizes. Single crystal quartz is also available.

Other thin products offered by the company are:

• Ultra-Thin Fused Silica
• Ultra-Thin Sapphire
• Ultra-Thin Quartz: Thin Fused Quartz windows and substrates from stock
• Ultra-Thin CVD Silicon Carbide
• Ultra-Thin Ceramic substrates and wafers
• Ultra-Thin all semiconductor materials: MEMS and bonded SOI Silicon wafers
• Ultra-Thin semiconductor dice-chips: Thin dice by thinning after dicing

Other materials include: ZnS to 0.0015″ polished both sides, Be to 0.0008″ polished both sides, Lithium Niobate, Yitrium, bundled fibers, coatings and oxide layers, Zerodor, Macor, Glass Ceramics, Corning Polarcor, Graphite, Carbide, Ferrites, PZT, Steatite, Bonded Glass-Silicon, and many others.

Related information:

• https://valleydesign.com/quartz-silica/optical-glass/Properties of optical glass
• www.osa.orgAmerican Optical Society
• www.edgepolishing.comEdge and angle polishing
• www.edgepolishing.com/die-thinningWafer and die thinning technology

Valley stocks precision lapped Ceramic substrates for thin and thick film capacitor manufacturers. Typical sizes are 1″, 2″, 3″, 4″ square x 0.002″ – 0.005″ thick. Surface finish is fine lapped both sides 8-16 u” Ra. Other sizes and thicknesses are available, as thin as 0.002″ (50 microns). These substrates can also be diced into dies as small as .010″ square.

During the chip capacitor fabrication process, cracks can be introduced during any time during steps such as pick and place machining, vacuum pick-up, board depanelization, soldering, test fixturing, connector insulation and final assembly. Valley’s process has been optimized to minimize stresses in Ceramic materials, even at very thin states.

When polished Ceramics are required, Valley stocks 99.6% Alumina which can be polished to 0.5 u” Ra. Stock sizes range from 1″ – 4″ square x 0.002″ – 0.005″ thick.

Other materials are also utilized for dielectric thin substrates including Quartz, Sapphire, steatites and others. These are also stocked and processed by Valley Design.

Information on Ceramic substrates:

• https://valleydesign.com/aluminum-nitride/ Aluminum Nitride Ceramic substrates
• https://valleydesign.com/custom-dicing/capacitors/ Dicing chip capacitor substrates
• https://valleydesign.com/custom-dicing/custom-dicing/ Dicing, sawing and singulating
• www.imaps.org International Microelectronics and Packaging Association
• https://valleydesign.com/laser-slag/ Substrate edge deburring, chamfering, polishing and blending
• valleydesign.com/ultra-thin-ceramics Thin Ceramics and thin Ceramic substrates and wafers

Valley offers CNC machining and dicing, rotary ultrasonic diamond and laser drilling of all materials including quartz, ceramics, glass, sapphire, polyimides, stainless steel and many other materials with configurations as small as 1mm x 1mm x 25 microns thick, which could also have a 1/2mm hole.  Parts can also be AR coated.

Typical core drilled parts:

-Customer supplied Alpha Quartz with MgF2 coating on one side.  Valley to thin and optically polish to .0012” + .00015” thick, then core drill to .65mm diameter.
-BK7 Glass 3.5mm + .125mm diameter x .25mm thick, polished both sides 60/40 scratch/dig
-BK7 Glass 4mm diameter x .25mm + .025mm thick, optically polished both sides 40/20 scratch/dig, < 7 Angstroms
-Fused Silica .115” + .004” diameter x .17mm + .005mm thick, optically polished both sides 20/10 scratch/dig, < 7 Angstroms
-Glass or quartz wafer .170” diameter x .010” thick, polished both sides, coated with optical coating
-Stainless Steel .085” + .004” diameter x .010” + .001” thick, polished both sides mirror finish < 50 Angstroms Ra

Typical hole drilled parts:

-96% Alumina 15mm square x .7mm – 1mm thick, flat to < .025µm, with one 10mm diameter through hole in center of substrate
-A-plane Sapphire 10mm diameter x .0035” + .0005” thick, polished both sides 60/40 scratch/dig, with 2mm diameter central hole
-Aluminum Nitride block 15mm x 14mm x 2mm with one 3mm diameter hole
-Aluminum Nitride .88” x 2.3” x .250” thick, lapped both sides 25µ” Ra, with .280” diameter central hole
-Aluminum Nitride 29.35mm x 8mm x .015” thick with 15 degree angle corner crop, and 2 holes drilled 4.80mm + .13mm diameter
-AlN Package Dummy 52.2mm + .26mm x 30mm + .15mm x 4.3mm + .15mm thick, with .5mm + .05mm diameter holes
-Dragontrail glass (chemically strengthened) 4.262” x 4.035” + .012” x .041” – .046” thick.  Cut 4 corners with .226” radius, and drill 4 through holes .402” width with .201” radius at the bottom of the hole.  Drill 1 through hole each .874” .343” and .079” diameters + .012”
-Fused Silica 100mm diameter x .5mm + .025mm thick, optically polished both sides 20/10 scratch/dig < 7 Angstroms with center hole 15.5mm + .02mm, central hole position .02mm
-Silicon 10mm square x .5mm + .025mm thick, lapped both sides 25u” Ra, with one 2.5mm + .1mm square hole in center

Valley Design has extensive experience with these and other similar projects.  Many various materials are processed by Valley from hard ceramics and Sapphire, to metals, quartz and glass.  Contact us for your hole drilling and core drilling requirements, as well as keep us in mind for any other precision machining including lapping, optical polishing, dicing, backgrinding, slicing and CNC machining.

Silicon-Direct-Bonding (SDB) or Wafer-Direct-Bonding (WDB) also referred to as Fusion Bonding is accomplished when smooth and flat Silicon surfaces are brought together at high temperature. High quality surface finishes (<10A), when required, are provided by Valley Design.

Anodic Bonding, also referred to as Electrostatic Bonding, is a process where glass to Silicon or a metal is permanently attached with an irreversible chemical bond. This is accomplished with heat and high voltage.

SOI Silicon-On-Insulator refers to a thin layer of Silicon on top of an insulating layer such as glass or Silicon Oxide.

For answers to your complex technology needs, come to the company that has been a leader in advanced and ultra thin materials processing for nearly 50 years. Valley had pioneered the innovative techniques used to produce the substrates and components for MEMS and many other applications. Valley also stocksmany of these materials.

Additional information on MEMS and other related processes:

• https://valleydesign.com/custom-dicing/bonded-wafers/ Dicing bonded wafers
• valleydesign.com/semi-wafers.htm Polished glass wafers and substrates to SEMI standards
• www.sensorsmag.com Silicon wafer bonding
• https://valleydesign.com/silicon-wafers/thinned Silicon wafers thinned to produce thinner dice-chips
• https://valleydesign.com/quartz-silica Fused Silica substrates and wafers
• www.edgepolishing.com/die-thinning.htm Wafer and die thinning technology
• https://valleydesign.com/custom-dicing/thin-dice/ Thin dice by thinning after dicing

Ultra-Thin Aluminum Nitride Lapped Substrates

Tolerances
Thickness:	± 0.001″
Surface:	25 u” Ra
Thermal Conductivity:	175 W/mk
Length & Width:	± 0.005″ diamond cut

Return to Home Page: Thin precision glass sheets

Some of the more common materials used for small optical windows include:

OPTICAL MATERIALS

• BK7 Glass
• Fused Silica
• Fused Quartz
• IR Grade Fused Silica
• UV Grade Fused Silica
• Pyrex 7740
• Silicon
• Sapphire

SHEET GLASS MATERIALS

• 1737 Glass
• 7059 Glass
• AF 45
• Borofloat glass
• Borosilicate glass
• B270 Glass
• D263 Glass
• Float glass
• Soda Lime Glass

BLOCK GLASS

• 7070 Glass
• BG40 Glass
• BK7 Glass
• Pyrex 7740 Glass

Please call or e-mail for a quotation to meet your specifications.