Archives: Landing Domains

Valley Design can help you with your most demanding CNC machining projects. Taking Fused Silica from our extensive in-house inventory or your own supplied material or modification needs.

When micron level tolerances and accuracy are crucial our metrology lab utilizes the newest and most advanced CMM technology and 3D profile metrology assuring outstanding quality and product performance.

Our state-of-the-art Haas 4 – 5 Axis Fused Silica CNC machining and grinding technology can achieve micron level tolerances and repeatability of ± .5um (microns).

• Optimum Diamond tool selection.
• Diamond tool wear technology.
• Advanced non-contact laser-based tool setting.
• Vacuum hold down technology.
• Custom adhesion hold down and release technology.
• Proprietary tooling and advanced fixturing technology.

Complex Features

Your ceramic list steps, slots, grooves etc. Plus a few new ones.

• Counter Bores
• Drilling
• Coring
• Light weighting
• Chamfers
• Bevels
• Concave / Convex surface profiles.

Fused Silica is used in the manufacturing of optical components and in applications and industries that include Aerospace, Telecommunications, Semiconductors, Medical, Lasers, Electronics, Scientific Instruments, Camera Lenses, and the Energy Industry.

Advantages of Fused Silica and Fused Quartz properties include the following:

• Extreme hardness
• High softening temperatures and thermal resistance
• High chemical purity and resistance
• Low thermal expansion with high resistance to thermal shocks
• High transparency from the ultraviolet to the infrared spectral range
• High radiation resistance
• Superior electrical insulation qualities

For a list of commonly stocked Fused Silica wafers and substrates, please click here.

25 years ago we made 300mm fused silica membranes, 25 microns thick (0.001”) optically polished both sides. We have advanced since then. Now parts can be fabricated in size ranges from as large as 609mm (24”), as thin as 25 micron thick and as small as .203mm. Our customers are among the top technology companies in the world including Applied Materials, Intel, KLA Tencor, Philips Medical, Boeing, NASA, Raytheon and others.

Material Properties
Datasheet
Transmission

Since Valley had not before polished this size nozzle, and there is no prescribed method, multiple polishing trials and R&D needed to be conducted, as well as devising a method to examine and quantify the defects inside of the nozzle.  In the end, NASA was extremely satisfied with the results, and has come to Valley Design repeatedly for assistance in polishing these types of wind tunnels, nozzles, slides and plates.

Polishing NASA wind tunnels and slides has given Valley Design additional experience to add to the broad based knowledge that Valley has accumulated over the past 37 years.  This enables us to polish various irregular and curved surfaces to Angstrom level RA finishes.  From one meter astronomical mirrors to as small as 1mm microchips, we have lapped and polished all types and sizes of parts, over multiple industries and applications.

Our experience with materials ranges from Plexiglas and Polyimides to as hard as Sapphire and all hardnesses in between.  If you have a project that appears impossible, Valley Design may be able to help.  Many customers come to Valley when no others can accomplish the goal, and we are typically able to satisfy special customer requirements.  Whether it is repairing used wind tunnels or polishing new flat and irregular surfaces in all materials, the wide variety and breadth of our experience gives us the advantage to satisfy your polishing needs.

Used equipment for sale includes lapping machines, ovens, kilns, air gauge, laser, laser power meter, 100mm wafer scriber.
For more detailed information and pricing, contact us.

Note: All equipment is being sold in As-Is condition with no warranty or guarantee expressed or implied. Buyer is responsible for shipping / pick-up arrangements. All equipment is located in our Shirley, MA facility. Please email us for pricing, more information, or for additional pictures.

Valley has in stock AlN substrates and AlN wafers with thermal conductivity of 175 W/mK and 200 W/mK to meet a variety of specification requirements.

High Thermal Conductivity Aluminum Nitride AlN Substrates
170 W/mK – 200 W/mK

Available for Immediate Delivery

Please call or e-mail for details (quantities and pricing may be subject to change)

For New Stock Items below:

Surface Finishes: AF = As Fired LBS = Lapped Both Sides (25u” Ra) PBS = Polished Both Sides (2u” Ra) P1S = Polished 1 Side (2u” Ra) / 2nd Side Lapped Improved tolerances, surface finishes and alternate sizes are also available. Visa, Mastercard, American Express and Purchasing Cards accepted.

NEW STOCK ITEMS

 

STANDARD STOCK ITEMS

 

---

Aluminum Nitride Related Links:

• Polished Aluminum Nitride AlN substrates and wafers
• Dicing Aluminum Nitride substrates
• Tape casting guide for Aluminum Nitride Substrates
• Slag removal Laser hole edge deburring
• Substrates Beryllium Oxide and Aluminum Nitride
• Laser drilling of Aluminum Nitride substrates
• Desirable properties of Aluminum Nitride
• Related web sites Aluminum Nitride

For more information, go to:

• www.svc.org Society of Vacuum Coaters
• www.edgepolishing.com Edge and angle polishing for optoelectronic devices.
• https://valleydesign.com/laser-slag/ Laser hole edge deburring, chamfering, and blending.
• https://valleydesign.com/ceramic-substrates/ Dicing hybrid and semiconductor circuits, prototype and production.
• valleydesign.com Lapping, polishing, and dicing state of art materials.
• https://valleydesign.com/quartz-silica/ Fused Silica and Fused Quartz substrates.
• www.acers.org American Ceramic Society
• https://valleydesign.com/silicon-wafers Polished Silicon wafers.
• https://valleydesign.com/ultra-thin/ Thin Ceramics, thin semiconductors and thin optical materials.

Valley Design stocks and processes a wide variety of materials for information display and related applications. These materials come in standard sizes or can be machined to your custom specifications.

Services provided include precision lapping, polishing, dicing, edge/angle polishing, fiber array polishing, grinding and coating services and manufactures substrates, windows, wafers, wedges, hot and cold mirrors, glass rods and spacers, lenses, beam splitters, wave guides and other components. Wafers are routinely processed to SEMI specs up to 300 mm diameter, and larger by request.

Specialties are Ultra-Thin (as thin as 12.5 microns), Ultra-Flat (1/20 wave), Super polishing (<10/5 scratch/dig or 5-10 angstroms), tight tolerances (± 1 micron) and dicing as small as .005″ square. The end faces and outer diameters of many of these materials can also be optically polished.

· 1737F: Near zero alkali aluminosilicate composition glass, economically priced, withstands rigorous thermal cycles of polysilicate transistor processes. Used as substrates for electronic thin film circuits, polysilicate transistor processes, active matrix flat panel displays, microdisplays, TFTs and AMLCDs.

· B270/Crown Glass: High transparency material with uniform optical transmission characteristics in the visible spectrum as well as the IR and UV regions. Applications include display covers, high resolution scanners, optical elements for light sensors, optical windows, substrates, lenses.

· Borosilicates: (AF-45, D263, 7059, Borofloat) Low alkali glass featuring excellent thermal resistance, low coefficient of thermal expansion and optical transmission. These glasses can be used in thin film devices, LDC (active matrix), electroluminescent.

Most optical materials, including fused silica and fused quartz substrates and wafers can be processed in sizes as large as 12″ square or 12″ diameter. Thickness tolerances can be as tight as ±.0001″, with flatness to 1/4 lightband, and parallelism to 50 millionths of an inch. Custom fused silica windows in any size, shape, thickness or surface finish are available on special orders.

Valley offers a complete line of lapped, polished and diced substrates, flat polished fused silica optical pieces, Sapphire, Glass and other materials. Our best polish for optics, <10/5 or super-polished to 3-4 Angstroms, thinnest parts, 0.0005″. Valley also wafers optical materials and performs precision lapping and polishing of metals and delivers coated optics to the optics industry, OEM manufacturers and research laboratories.

Valley can also optically polish the end faces and edges of fused silica, fused quartz, silicon and numerous other materials.

Informative fused silica and fused quartz related Web sites:

• valleydesign.com Optical polishing of all materials associated with optics, semiconductors fiber optics, optoelectronics, microelectronics and telecommunications
• www.osa.org OSA – Optical Society of America
• www.photonics.com The Photonics Buyers Guide to products and manufactures
• https://valleydesign.com/ultra-thin/ Ultra thin glass, Fused Silica, Quartz, Sapphire, Silicon, wafers, Dice, substrates and all other hard materials
• www.edgepolishing.com Telecommunication, optical, optoelectronic, microelectronic and fiber optic edge and angle polishing
• https://valleydesign.com/silicon-wafers State-of-the-art semiconductor wafer polishing, dicing, shaping and die thinning
• www.apomanet.org APOMA – The American Precision Optics Manufacturers Association for the precision optics industry
• https://valleydesign.com/aluminum-nitride/ Aluminum Nitride AlN substrates and wafers
• https://valleydesign.com/laser-slag/ Laser slag removal from lasered substrates and wafers
• https://valleydesign.com/ceramic-substrates/ Dicing of all hard materials for research and production

Transmission Curve and Technical Data Sheet

Because it is an anisotropic hexagonal/rhomohedral crystal, some properties depend on the crystallographic direction and these directions are specified relative to the optical C-axis.

Sapphire wafer and substrate applications include:

• Microelectronic IC applications
• SOS Silicon-on-Sapphire
• Growth of superconducting compounds / Gallium Nitride
• Infrared detectors
• Hybrid microelectronics
• Polishing carriers
• Hostile environment
• Optical transmission from ultraviolet to near infrared
• High temperature
• Radiation resistance

Informative Sapphire Web sites:

• www.edgepolishing.com Edge and angle polishing for optoelectronic devices
• https://valleydesign.com/ceramic-substrates/ Dicing of Sapphire wafers and substrates
• https://valleydesign.com/sapphire-wafers/sapphire Synthetic Sapphire
• https://valleydesign.com/sapphire-wafers/dicing Dicing
• https://valleydesign.com/sapphire-wafers/disco-dicing Disco dicing saws and dicing blades
• https://valleydesign.com/ultra-thin/ Sapphire ultra-thin wafers, substrates and windows
• https://valleydesign.com/quartz-silica/sapphire/ Sapphire index of refraction

Accurate dicing services for customer materials up to 6″ in diameter or square and rectangles as large as 6″x14″. Materials processed are as diverse as Fused Silica, Silicon wafers, Glass, Sapphire and Quartz disks, Silicon Carbide, Ferrites, Ceramics, MEMS and hybrid circuits as well as delicate compound semiconductors like GaN and InP. Many of these wafers and materials are in stock.

Custom dicing capabilities can also extend the services of your wafer fab enabling you to handle production pressures as we meet your requirements for kerf, chip specifications, and delivery. Depending upon the material, the dicing kerf may be as small as .001″ and die size as small as .005″ square.

Additional cutting-dicing services include slotting, singulating, angling and cutting through layered assemblies like Silicon-on-Glass, machining grooves, Sapphire, glass and metal rod cutting and rough cutting of plates as large as 18″ x 18″. Valley also provides backlapping and thinning services for wafers up to 12″ diameter, along with lapping and commercial or optical polishing of most materials, edge polishing , and polishing of semiconductor wafers up to 300mm in diameter.

For a complete summary of dicing capabilities click here.

Please click here for a dicing quotation per your specifications.

Informative related Web sites:

• www.semi.org Semiconductor Equipment and Materials
• www.edgepolishing.com Polishing edges and edge angles
• https://valleydesign.com/aluminum-nitride/ Aluminum Nitride Ceramic substrates
• valleydesign.com Electro-Optical materials processing for microelectronics, Fiber Optics, optics and semiconductor industries
• www.imaps.org IMAPS International Microelectronics and Packaging Association for advancement of microelectronics and electronic packaging
• https://valleydesign.com/ultra-thin/ Thinning of all hard materials to micron thickness
• https://valleydesign.com/laser-slag/ Laser slag removal from lasered Aluminum Nitride and Aluminum Oxide Ceramic Substrates
• https://valleydesign.com/quartz-silica/ Fused Silica and Fused Quartz wafers custom made and also from extensive finished stock
• https://valleydesign.com/silicon-wafers Specializing in ultra-tight tolerance wafers and float zone optical grade Silicon materials
• https://valleydesign.com/sapphire-wafers Sapphire wafers and substrates
• https://valleydesign.com/germanium-crystals/ Germanium Ge infrared optical components and windows
• https://valleydesign.com/custom-dicing/wafer-dicing/ Wafer dicing, sawing, singulating and backgrinding

• Optical glass polishing
• Polished Fused Silica wafers, substrates, and windows
• Fused Quartz
• Single crystal Quartz
• Polished ultra-thin wafers and substrates from all materials
• IR optical materials – GaAs, CdTe, HgTe, (Cd-Hg)Te
• Polished Sapphire materials
• UV materials
• Optical grade Silicon
• Super-polished metal optics
• Indars Interferometer for thin transparent wafer flatness measurement
• Polished metals
• Polished Silicon wafers
• Polyimide wafers
• Polished ceramics

• Composite materials
• Silicon Carbide
• Hard coated Aluminum polishing
• Fiber optic array polishing
• CMP polishing of oxide coatings
• Angle and edge optical polishing
• Polished solar cell covers
• AR coated optics
• Planarization and polishing dielectric and metal films
• Ultra-thin wafer and substrate polishing
• Wafer thinning
• III-V compound semiconductor polishing and thinning (GaP, GaN, InSb, InP)
• II-VI semiconductor materials (Cadmium Selenide, Zinc Oxide, Zinc Sulfide, Zinc Selenide, Zinc Telluride)
• Optically polished glass

Please call or email for more information, or for a quotation to meet your optical polishing requirements.

Blackest Vacuum Deposited Coatings for IR, VIS & UV

Applications include:

• IR detector cold shields
• Space-born optical systems
• Detector and optical system parts – cooled and un-cooled
• Sharp edge diaphragms and blades
• Wafer level packaging, MEMS

The coating is also available in coated roll material form, with or without self adhesive backing for:

• Blackbodies, thermal radiation detectors
• Contrast enhancement in displays and LED modules
• Solar energy absorbers
• Applications requiring ultra-high specific surface area in capacitor/battery electrodes and nano porous materials.

For overall black optical coating types, click here.

Related websites: Materials that absorb over 99% light